Multi-die DC-DC Boost Power Converter with Efficient Packaging

ABSTRACT

A DC-DC boost converter in multi-die package is proposed having an output Schottky diode and a low-side vertical MOSFET controlled by a power regulating controller (PRC). The multi-die package includes a single die pad with the Schottky diode placed there on side by side with the vertical MOSFET. The PRC die is attached atop the single die pad via an insulating die bond. Alternatively, the single die pad is grounded. The vertical MOSFET is a top drain vertical N-channel FET, the substrate of Schottky diode die is its anode. The Schottky diode and the vertical MOSFET are stacked atop the single die pad. The PRC is attached atop the single die pad via a standard conductive die bond. The Schottky diode die can be supplied in a flip-chip configuration with cathode being its substrate. Alternatively, the Schottky diode is supplied with anode being its substrate without the flip-chip configuration.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation in part (CIP) of the following patent applications:

-   -   “Bottom Source LDMOSFET Structure and Method”, Ser. No.         11/495,803, Jul. 28, 2006, François Hébert     -   “BOOST CONVERTER WITH INTEGRATED HIGH POWER DISCRETE FET AND LOW         VOLTAGE CONTROLLER”, Ser. No. 11/761,301, Jun. 11, 2007, Allen         Chang et al     -   “HIGH VOLTAGE AND HIGH POWER BOOST CONVERTER WITH CO-PACKAGED         SHOTTKY DIODE”, Ser. No. 11/761,313, Jun. 11, 2007, Allen Chang         et al     -   “BOTTOM ANODE SCHOTTKY DIODE STRUCTURE AND METHOD”, Jul. 19,         2007, François Hébert         whose content is incorporated herein by reference for any and         all purposes.

FIELD OF INVENTION

This invention relates generally to the field of electrical power supply and conversion. More specifically, the present invention is directed to the physical level packaging of a switching power supply, and DC-DC voltage converters.

BACKGROUND OF THE INVENTION

Owing to its compact size, low weight and generally high efficiency, switching power supplies and converters have enjoyed ever increasing market adoption in the consumer electronics industry. This is especially so in portable applications where compact size, low cost, low weight and long battery life are all highly important considerations. Also, due to increased complexities and features of portable devices, there is an increased demand for different voltage levels within one portable device. For example, a display may require a different operating voltage than an interface product, which may require a different operating voltage than a micro-processor. The various operating voltages for each of building blocks of the portable device can be provided by different DC-DC voltage converters.

One well known example of the switching power supply and conversion is a simplified boost power converter schematic 1 shown in FIG. 1. An unregulated DC input 2, VIN, is boosted up into a regulated DC output 3, VOUT, through an energy storage and switching network having a Schottky diode 5, a vertical MOSFET 4 and a inductor 11. For those skilled in the art, the physical die of a vertical MOSFET has its source and drain built on the opposite surfaces of the die hence its device current flows in a direction perpendicular to the die surface, and this is why the device is referred to as a vertical device. A power regulating controller 13, whose internal details are only briefly illustrated, controls the gate 10 of the vertical MOSFET 4 with a grounded source 8 and a drain 9 connected to both the anode 6 of the Schottky diode 5 and the inductor 11. The regulated DC output 3, being connected to the cathode 7 of the Schottky diode 5, is also connected through a charging/discharging output capacitor 12 to ground 14. As illustrated, the vertical MOSFET 4 is a vertical N-channel FET with its device current flowing in a direction from the unregulated DC input 2 to ground 14. By way of an actual example, the unregulated DC input 2 can range from +2.7 to +5.5 volts from a Li-ion battery and the boosted up regulated DC output 3 can be adjusted up to +32 volts. For those skilled in the art, by simply replacing the vertical MOSFET 4 with a vertical P-channel FET and reversing the connection polarity of the Schottky diode 5, the boost power converter schematic 1 will then boost an unregulated negative input voltage (e.g., −3.3+/−10% volts) into a regulated negative output voltage of higher magnitude (e.g., −28 volts).

For embodiment into a physical product, the numerous integrated circuit (IC) dies corresponding to the Schottky diode 5, the vertical MOSFET 4 and the power regulating controller 13 need to be mounted onto different die pads to pack the semiconductor devices of the circuit into one package. At the packaging level, it is important to package the numerous IC dies efficiently with a reduced number of die pads and to use standard lead frames. The resulting benefits are reduced product size, lower cost, reduced time to market (by using standard available lead-frames) and in many cases include reduced circuit parasitics.

A prior art packaging example of FAIRCHILD FAN5606, a serial LED driver with current-regulated, step-up DC-DC converter, is illustrated in FIG. 2A. Notice that there are two die pads, die pad 20 a and die pad 20 b, located on a lead-frame 22. As a die-pad clearance 21 must exist between the die pads 20 a and 20 b, the resulting lead-frame 22 size has become larger than an otherwise lead-frame with a single die pad. Additionally although not directly visible here, minimum geometrical constraints of inter-die wire bonds could cause an even larger inter-die spacing hence further increases the resulting lead-frame 22 size and this will be presently illustrated.

A prior art multi-die package 35 of the boost power converter schematic 1 is illustrated in FIG. 2B. The Schottky diode 30 die typically comes with its cathode 30 b as the bottom substrate and its anode 30 a on the top. The vertical MOSFET 31 die typically comes with its MOSFET drain 31 b as the bottom substrate and its MOSFET source and gate 31 a on the top. Hence, two isolated die pads, Schottky diode die pad 30 c and MOSFET die pad 31 c, are required in the lead frame to seat the Schottky diode 30 die and the vertical MOSFET 31 die and to finally package them into one package covered with molding compound (not shown) before it is assembled onto a PC-board 33 with other circuit elements (such as inductors and capacitors) to complete the circuit. Additionally, bond wires 34 a are required to effect an electrical connection between the anode 30 a of the Schottky diode 30 and the MOSFET drain 31 b of the vertical MOSFET 31 inside the package. As another illustrative part of the prior art multi-die package 35 although not essential for the understanding of the present invention, bond wires 34 b are required to effect an electrical connection between the MOSFET source and a ground lead 32.

As a minimum clearance between the two isolated die pads (Schottky diode die pad 30 c and MOSFET die pad 31 c) must be maintained for isolation and product reliability, this results in a larger package size and the use of non-standard lead frame thus leads to higher cost. The required bond wires 34 a further increases the cost of the package. Additionally, the bond wires 34 a, owing to their associated parasitic capacitance and inductance, can also cause a degradation of the power conversion efficiency of the boost power converter. In essence, there exists a need to reduce complexity and space requirement of the prior art multi-die package 35.

SUMMARY OF THE INVENTION

An efficiently packaged multi-die semiconductor package for a DC-DC boost converter application is proposed. The boost converter converts an unregulated DC input into a regulated DC output. The boost converter has an output Schottky diode and a low-side vertical MOSFET whose gate is controlled by a power regulating controller (PRC). The multi-die semiconductor package includes a lead-frame with a single die pad, the vertical MOSFET is placed atop the die pad, and a Schottky diode with its anode connected to the drain of the vertical MOSFET.

In one embodiment, the Schottky diode is placed on the die pad side by side with the vertical MOSFET with the anode of the Schottky diode electrically connected to the drain of the vertical MOSFET via the die pad. Correspondingly, the PRC die is attached atop the single die pad via an insulating die bonding material to achieve a further reduced footprint of the single die pad with the Schottky diode, the vertical MOSFET and the PRC co-packaged atop the single die pad.

In an alternative embodiment the single die pad is grounded. Correspondingly, the vertical MOSFET is a vertical N-channel FET, the substrate of the Schottky diode die is its anode and the top of the vertical MOSFET is its drain. The Schottky diode die and the vertical MOSFET die are co-packaged atop the single die pad in a stacked way with the Schottky diode die atop the vertical MOSFET die for minimized vertical MOSFET source inductance and easy heat sinking. With the single die pad grounded, the PRC die can be attached atop the single die pad via a standard conductive die bonding material to achieve a further reduced footprint of the single die pad with the Schottky diode, the vertical MOSFET and the PRC co-packaged atop the single die pad.

In a more detailed embodiment, the Schottky diode die is supplied with its cathode being its substrate and the Schottky diode die is packaged in a flip-chip configuration. Alternatively, the Schottky diode die is supplied with its anode being its substrate and the Schottky diode die can then be packaged without using the flip-chip configuration.

For application where both the unregulated DC input and the regulated DC output are negative voltages hence the vertical MOSFET is a vertical P-channel FET, the Schottky diode die is supplied with its substrate being its cathode while the substrate of the vertical MOSFET being its drain. The Schottky diode die and the vertical MOSFET die are then co-packaged side by side atop the single die pad. Correspondingly, the PRC die is attached atop the single die pad via an insulating die bonding material to achieve a further reduced footprint of the single die pad with the Schottky diode, the vertical MOSFET and the PRC co-packaged atop the single die pad.

For applications where both the unregulated DC input and the regulated DC output are negative voltages hence the vertical MOSFET is a vertical P-channel FET, the single die pad can be grounded. Correspondingly, the Schottky diode die can be supplied with its substrate being its cathode while the top of the vertical MOSFET being its drain. The Schottky diode die and the vertical MOSFET die are co-packaged atop the single die pad in a stacked way with the Schottky diode die atop the vertical MOSFET die for minimized vertical MOSFET source inductance and easy heat sinking. With the single die pad grounded, the PRC die can be attached atop the single die pad via a standard conductive die bonding material to achieve a further reduced footprint of the single die pad with the Schottky diode, the vertical MOSFET and the PRC co-packaged atop the single die pad.

These aspects of the present invention and their numerous embodiments are further made apparent, in the remainder of the present description, to those of ordinary skill in the art.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more fully describe numerous embodiments of the present invention, reference is made to the accompanying drawings. However, these drawings are not to be considered limitations in the scope of the invention, but are merely illustrative.

FIG. 3A, FIG. 3B and FIG. 3C illustrate a first embodiment of the present invention multi-die semiconductor package;

FIG. 4A, FIG. 4B and FIG. 4C illustrate a second embodiment of the present invention multi-die semiconductor package;

FIG. 5A, FIG. 5B, FIG. 5C and FIG. 5D illustrate a third embodiment of the present invention multi-die semiconductor package; and

FIG. 6A, FIG. 6B and FIG. 6C illustrate a fourth embodiment of the present invention multi-die semiconductor package.

DETAILED DESCRIPTION OF SPECIFIC EMBODIMENTS

The description above and below plus the drawings contained herein merely focus on one or more currently preferred embodiments of the present invention and also describe some exemplary optional features and/or alternative embodiments. The description and drawings are presented for the purpose of illustration and, as such, are not limitations of the present invention. Thus, those of ordinary skill in the art would readily recognize variations, modifications, and alternatives. Such variations, modifications and alternatives should be understood to be also within the scope of the present invention.

FIG. 3A (side view), FIG. 3B (top view) and FIG. 3C (top view) illustrate a first embodiment of the present invention multi-die package 45 and 45 a with Schottky diode 40 and the vertical MOSFET 41 enclosed in molding compound 49. Compared with the prior art multi-die package 35 of FIG. 2B that uses two die pads (Schottky diode die pad 30 c and MOSFET die pad 31 c), the present invention only needs a lead-frame 40 d with single die pad 40 c for packaging both the Schottky diode 40 and the vertical MOSFET 41 into one package to be mounted onto a PC-board 43. While the die-level device terminal configuration for the vertical MOSFET is the same between FIG. 2B and FIG. 3A (bottom substrate=MOSFET drain 31 b and 41 b, top surface=MOSFET source and gate 31 a and 41 a), the die-level device terminal configuration for the Schottky diode is reversed between FIG. 2B and FIG. 3A in that:

FIG. 2B: bottom substrate=cathode 30 b, top surface=anode 30 a

FIG. 3A: bottom substrate=anode 40 a, top surface=cathode 40 b

As noted in FIG. 2B, the Schottky diode 30 die typically comes with its cathode 30 b as the bottom substrate and its anode 30 a on the top. Hence, to realize the various embodiments of the present invention wherein the bottom substrate of the Schottky diode is its anode the Schottky diode must be custom made accordingly. Such a bottom anode Schottky diode is disclosed in patent application entitled “BOTTOM ANODE SCHOTTKY DIODE STRUCTURE AND METHOD” filed on Jul. 19, 2007 and is incorporated herein as reference. In this way, the present invention effected the required connection between the Schottky diode anode 40 a and the MOSFET drain 41 b with the single die pad 40 c while eliminating the otherwise complexity of bond wires in between (bond wires 34 a of FIG. 2B). Thus, compared with the prior art multi-die package 35 of FIG. 2B, the single die pad 40 c of the present invention advantageously realizes a smaller package size by using standard single die pad lead frame. The absence of the bond wires 34 a decreases the packaging complexity hence lower the manufacturing cost. Additionally, undesirable parasitic capacitance and inductance associated with the bond wires 34 a are also eliminated. As a side remark, the bond wires 34 b between the MOSFET source 31 a and the ground lead 32 in the prior art are still needed in this present invention multi-die package 45 and they are labeled bond wires 44 b terminated in a corresponding ground lead 42 a. As another side remark, the bond wires 44 c between the Schottky diode cathode 40 b and a Vout lead 42 b in the present invention are also required in the prior art multi-die package 35, they were simply omitted in the prior art multi-die package 35 to avoid unnecessarily obscuring the details. As yet another side remark, the bond wires 44 d between the MOSFET gate 41 a and a gate lead 10 a in FIG. 3B in the present invention are also required in the prior art multi-die package 35, likewise not illustrated in the prior art multi-die package 35 to avoid unnecessary obscuring details.

The incorporation of the PRC 46 die in the packaging is illustrated in FIG. 3C. To maintain the numerous advantages of the single die pad 40 c which is not grounded, the PRC 46 die is attached to the single die pad 40 c via an insulating die bonding material 47 such as non-conductive epoxy. Electrical connections between the PRC 46 die and the leads are effected via bond wires 44 e as illustrated. Thus, the Schottky diode 40, the vertical MOSFET 41 and the PRC 46 are co-packaged atop the single die pad 40 c.

FIG. 4A (side view), FIG. 4B (top view) and FIG. 4C (top view) illustrate a second embodiment of the present invention multi-die package 50 and 50 a with Schottky diode 40 and the vertical MOSFET 51 enclosed in molding compound 49. Compared with the previous present invention multi-die package 45 of FIG. 3A, the die-level device terminal configuration for Schottky diode 40 is the same between FIG. 3A and FIG. 4A (bottom substrate=anode 40 a, top surface=cathode 40 b). However, the die-level device terminal configuration for the vertical MOSFET is reversed between FIG. 3A and FIG. 4A in that:

FIG. 3A: bottom substrate=MOSFET drain 41 b, top surface=MOSFET source and gate 41 a

FIG. 4A: bottom substrate=MOSFET source 51 a, top surface=MOSFET gate and drain 51 b

As noted in FIG. 2B, the vertical MOSFET 31 die typically comes with its MOSFET drain 31 b as the bottom substrate and its MOSFET source and gate 31 a on the top. Hence, to realize the various embodiments of the present invention wherein the bottom substrate of the MOSFET is its source the MOSFET must be custom made accordingly. Such a bottom source MOSFET is disclosed in patent application Ser. No. 11/495,803 filed on Jul. 28, 2006 and is incorporated herein as reference. In this way, the present invention multi-die package 50 also effected the required connection between the Schottky diode anode 40 a and the MOSFET drain 51 b with a single die pad 40 c while eliminated the otherwise complexity of bond wires in between (bond wires 34 a of FIG. 2B). However, instead of placing the Schottky diode 40 and the vertical MOSFET 41 side by side as in FIG. 3A, the multi-die package 50 co-packages the Schottky diode 40 and the vertical MOSFET 51 atop the single die pad 40 c in a stacked way with the Schottky diode 40 die atop the vertical MOSFET 51 die and this results in a further reduced package that would take up a smaller PC-board 43 size. Additionally, as the MOSFET source 51 a can be inherently grounded through the stack of single die pad 40 c, the bond wires 44 b of FIG. 3A are eliminated as well resulting in further reduced die pad size, minimized vertical MOSFET source inductance. As a side remark, the bond wires 44 f between the MOSFET drain and the Schottky anode lead-frame 52 in this present invention multi-die package 50 were required in the prior art and they were simply omitted in FIG. 2B to avoid unnecessarily obscuring the details. Likewise, the bond wires 44 c between the Schottky diode cathode 40 b and the Vout lead 42 b in the present invention were also omitted in the prior art multi-die package 35. Similarly, the bond wires 44 d between the MOSFET gate 51 b and the gate lead 10 a in the present invention were also omitted in the prior art multi-die package 35.

The incorporation of the PRC 46 die in the packaging is illustrated in FIG. 4C. As the single die pad 40 c is already grounded, the PRC 46 die can be simply attached to the single die pad 40 c via a standard conductive die bonding material 53 such as a conductive epoxy or solder. Additional electrical connections between the PRC 46 die and the leads are effected via bond wires 44 e as illustrated. Thus, the Schottky diode 40, the vertical MOSFET 51 and the PRC 46 are co-packaged atop the single die pad 40 c.

FIG. 5A, FIG. 5B, FIG. 5C and FIG. 5D illustrate a third embodiment of the present invention multi-die semiconductor package. As noted in FIG. 2B before, the Schottky diode 30 die typically comes with its cathode 30 b as the bottom substrate and its anode 30 a on the top. Hence, to realize the various embodiments of the present invention wherein the bottom substrate of the Schottky diode is its anode the Schottky diode must be custom made accordingly. However, in a simple alternative as illustrated in FIG. 5A, the Schottky diode can also be made with a typical process albeit into a flip-chip chip BGA (ball grid array) style Schottky diode 60 thus packaged with its cathode substrate 60 b on the top and its anode solder balls 61 at the bottom. The resulting embodiments 65 and 65 a, employing the packaging scheme as already illustrated in FIG. 3A, FIG. 3B and FIG. 3C, is illustrated in FIG. 5B, FIG. 5C and FIG. 5D. Likewise, the resulting embodiments 70 and 70 a, employing the packaging scheme as already illustrated in FIG. 4A, FIG. 4B and FIG. 4C, is illustrated in FIG. 6A, FIG. 6B and FIG. 6C using the flip-chip Schottky diode 60.

By now it should become clear to those skilled in the art that the numerous embodiments just described can be readily modified to suit other specific applications as well. For example, for applications wherein both the unregulated DC input 2 and the regulated DC output 3 are negative voltages hence the vertical MOSFET 4 is a vertical P-channel FET, the substrate of the Schottky diode 5 die should be its cathode and the bottom of the vertical MOSFET 4 can be its drain for a side by side co-packaging atop a single die pad. The PRC 46 die can then be attached to the single die pad via an insulating die bonding material. Alternatively, the single die pad is grounded, the substrate of the Schottky diode 5 die is its cathode and the top of the vertical MOSFET 4 is its drain then the Schottky diode 5 die and the vertical MOSFET 4 die are co-packaged atop the single die pad in a stacked way with the Schottky diode 5 die atop the vertical MOSFET 4 die for minimized vertical MOSFET source inductance and easy heat sinking. The PRC 46 die is now attached to the single die pad via a standard conductive die bonding material.

While the description above contains many specificities, these specificities should not be constructed as accordingly limiting the scope of the present invention but as merely providing illustrations of numerous presently preferred embodiments of this invention. For example, the present invention can be applied to circuit configurations with or without the PRC 46 die.

Throughout the description and drawings, numerous exemplary embodiments were given with reference to specific configurations. It will be appreciated by those of ordinary skill in the art that the present invention can be embodied in numerous other specific forms and those of ordinary skill in the art would be able to practice such other embodiments without undue experimentation. The scope of the present invention, for the purpose of the present patent document, is hence not limited merely to the specific exemplary embodiments of the foregoing description, but rather is indicated by the following claims. Any and all modifications that come within the meaning and range of equivalents within the claims are intended to be considered as being embraced within the spirit and scope of the present invention. 

1. An efficiently packaged multi-die semiconductor package for DC-DC boost converter application where the boost converter converts an unregulated DC input into a regulated DC output, the multi-die semiconductor package comprises: A lead-frame with a single die pad; a vertical MOSFET placed atop said die pad; and a Schottky diode with its anode connected to the drain of the vertical MOSFET.
 2. The multi-die semiconductor package of claim 1 further comprising a power regulating controller (PRC) for controlling the gate of the vertical MOSFET.
 3. The multi-die semiconductor package of claim 1 wherein the drain of the vertical MOSFET is at its bottom surface and the Schottky diode is placed on the die pad side by side with the vertical MOSFET with the anode of the Schottky diode being at its bottom surface and electrically connected to the drain of the vertical MOSFET via the die pad.
 4. The multi-die semiconductor package of claim 3 wherein the substrate of the Schottky diode die is its cathode with the Schottky diode die being packaged in a flip-chip configuration.
 5. The multi-die semiconductor package of claim 2 wherein the PRC die is further attached to the single die pad via an insulating die bonding material whereby achieving a further reduced footprint of the single die pad with the vertical MOSFET, the Schottky diode and the PRC co-packaged atop the single die pad.
 6. The multi-die semiconductor package of claim 5 wherein the substrate of the Schottky diode die is its cathode with the Schottky diode die being packaged in a flip-chip configuration.
 7. The multi-die semiconductor package of claim 1 wherein the single die pad is grounded, the vertical MOSFET is a vertical N-channel FET, the substrate of the Schottky diode die is its anode and the top of the vertical MOSFET is its drain whereby the Schottky diode die and the vertical MOSFET die are co-packaged atop the single die pad in a stacked way with the Schottky diode die atop the vertical MOSFET die for minimized vertical MOSFET source inductance and easy heat sinking.
 8. The multi-die semiconductor package of claim 7 wherein the PRC die is further attached to the single die pad via a standard conductive die bonding material whereby achieve a further reduced footprint of the single die pad with the vertical MOSFET, the Schottky diode and the PRC co-packaged atop the single die pad.
 9. The multi-die semiconductor package of claim 2 wherein both the unregulated DC input and the regulated DC output are negative voltages hence the vertical MOSFET is a vertical P-channel FET, the substrate of the Schottky diode die is its cathode and the bottom of the vertical MOSFET is its drain whereby the Schottky diode die and the vertical MOSFET die are co-packaged side by side atop the single die pad.
 10. The multi-die semiconductor package of claim 9 wherein the PRC die is further attached to the single die pad via an insulating die bonding material whereby achieve a further reduced footprint of the single die pad with the Schottky diode, the vertical MOSFET and the PRC co-packaged atop the single die pad.
 11. The multi-die semiconductor package of claim 2 wherein both the unregulated DC input and the regulated DC output are negative voltages hence the vertical MOSFET is a vertical P-channel FET, the single die pad is grounded, the substrate of the Schottky diode die is its cathode and the top of the vertical MOSFET is its drain whereby the Schottky diode die and the vertical MOSFET die are co-packaged atop the single die pad in a stacked way with the Schottky diode die atop the vertical MOSFET die for minimized vertical MOSFET source inductance and easy heat sinking.
 12. The multi-die semiconductor package of claim 11 wherein the PRC die is further attached to the single die pad via a standard conductive die bonding material whereby achieve a further reduced footprint of the single die pad with the Schottky diode, the vertical MOSFET and the PRC co-packaged atop the single die pad. 